UMC debuts 200mm Al BEOL fab process

Semiconductor foundry United Microelectronics Corporation (NYSE:UMC, TWSE:2303) launched the A+ technology platform, a specialized 0.11µm aluminum process manufactured in UMC's 8" wafer fabs.

The 0.11um full aluminum back end of line (BEOL) process is touted as a cost-effective alternative to mainstream 0.13µm and 0.11µm copper technologies. The A+ platform comprises technology offerings in logic/MM, RFCMOS, eFlash, eE2PROM, eHV and CIS. A full suite of IP, HV-LDMOS, I/O devices, RF models and passive components complete the comprehensive A+ offering, UMC reports. Aggressive Al-BEOL design rules are used with leading-edge 8" production technology, tailored for cost, performance, and functionality goals.

200mm wafers offer a cost-to-performance benefit for many semiconductor applications, said Steve Wang, vice president of Asian sales and corporate marketing at UMC, listing timing controllers, LCD controllers, remote controller, small panel display drivers, surveillance and medical CMOS image sensors, among others. This is the target device group for the A+ technology portfolio.

UMC (NYSE:UMC, TSE:2303) is a global semiconductor foundry that provides advanced technology and manufacturing services for applications spanning every major sector of the IC industry. UMC can be found on the web at http://www.umc.com.

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